Principal PCB & Substrate Layout Engineer (2 positions)
Location: Phoenix
Posted on: June 23, 2025
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Job Description:
Principal PCB & Substrate Layout Engineer (Contract) (Location:
Phoenix, AZ area) - Remote opportunities available. Description:
Client is seeking an experienced Principal PCB & Substrate Layout
Engineer to join their team. Client partners closely with the U.S.
government delivering onshore trusted microelectronics. Client
serves the aerospace, Defense, and Space sectors. To succeed in
this role, you should have the following skills and experience: •
Minimum Education: Bachelor's Degree in Engineering or equivalent
education and experience required • Minimum Experience: 10 years as
a PCB and/or High-Density Package Layout designer using industry
standard layout tools like Cadence APD • Experience with APD
physical and electrical constraint editor • HDI stack-ups,
including use of blind & buried micro-vias, specialty RF dielectric
materials, and trace width/spacing around 15um/15um down to 2um/2um
or below • Experience with 2.5D devices, interposer or substrate
design, flip-chip, surface mount, die stacking, package stacking,
substrate stacking and other techniques • Experience using a
Cadence schematic / netlist driven CAD layout process, e.g. Cadence
APD (Allegro) and supporting tools • High-end FPGA package or board
design experience • Ability to work with our Mechanical team to
design full 3D models for fit checks and thermal • Understanding of
layout techniques in Digital, Analog, and/or RF layouts • Knowledge
of electronic packaging techniques • Experience using a CAM package
for manufacturing data validation. Knowledge of CAM350 & Blueprint
is preferred • Working knowledge of JEDEC /IPC design, fabrication,
and assembly specifications • Experience creating assembly
documentation and fabrication deliverables per company and industry
standards • Must be a US Person You are responsible for: Providing
technical leadership to the engineering team specifically focused
on High-Speed Interfaces and High Density Substrates layout
techniques and understanding and improving our layout development
processes to ensure we produce quality products using your
expertise in PCB and Substrate layout engineering.
Responsibilities: • Driving design, layout, and analysis of
complicated electrical and mechanical systems and their constituent
parts including: high-density interposers, substrates, and printed
circuit board (PCB) layouts. This includes power, digital, analog,
and RF signals across multiple die (primarily flip-chip) • Hands on
high-speed, multi-layer packaging, high-density interconnects
(HDI), blind and buried vias, ball grid arrays (BGAs), RF, design
for test (DFT), impedance calculations, cross talk, differential
pairs, PCB stack-ups, PCB via structures, electromagnetic
compatibility (EMC), material studies/selection, etc. • Understand
Design For Manufacturing rules of our suppliers and ensure design
process matches their capabilities • Understand and provide
fabrication drawings that match the intent of the design and
support the fabrication suppliers to ensure the technical intent is
transferred successfully • Support package material
characterization frequency dependent model; skin effects,
smoothness, roughness, dielectric loss and dielectric constant •
Work with peers and the engineering team to review the artwork and
drawings at different stages and at the final design review for
fabrication and assembly • Provide support for multidisciplinary
investigations and feasibility studies with collaboration across
engineering disciplines • Provide Technical guidance for
interfacing to customers, subcontractors, assemblers, fabricators,
and vendors/suppliers, operations, quality, supply chain, and
supporting organizations • Works on complex issues where analysis
of situations or data requires an in-depth evaluation of variable
factors • Considers the effects of actions on the system as a
whole, i.e. “systems-thinking” • Willing to help the team in areas
outside of specific technical discipline to accomplish goals
Keywords: , Phoenix , Principal PCB & Substrate Layout Engineer (2 positions), Engineering , Phoenix, Arizona
